Electronic Manufacturing Services Capabilities
Our advanced manufacturing facility and well-qualified engineers allow us to provide full-service product manufacturing with JIT-dependability, flexibility, and world-class quality.
Process Design for Optimal Cost, Yield, and Delivery:
- Design for Manufacturability Evaluation and Process Plan is included in initial assessment
- Technical Program Management
Printed Circuit Boards (PCBs):
- Single- and Double-Sided Assembly
- Surface-Mount (SMT), Through-Hole, and Mixed Technologies
- Ball Grid Array (BGA) to 0.4mm pitch, and 0402 Packaged Components
- RoHS-compliant or Leaded
- Aqueous Wash or No-Clean Processes
- Two SMT Lines
- Selective Solder Machine for Plate-Through Automation
Electro-Mechanical Assembly:
- Box Build
- Cable Harness / Routing
- Heatsink Assembly
- Conformal Coat or Potting
Test & Troubleshoot:
Test to your protocol to ensure 100% accurate build
Quality Assurance Processes ensure builds are accurate and repeatable:
- Workmanship Standards to IPC Class 2 or 3
- Documentation Management of Bill of Materials and Assembly
- Instructions
- Moisture Sensitive Parts Handling
- Electro-Static Discharge (ESD) Prevention
- Parts Sourcing ensures only approved parts are used
- Visual Inspections throughout the build
Purchasing and Inventory Management:
- Turnkey Component Sourcing — from your BOM and approved supplier list
- Component Cost Reduction
- End-of-Life and Obsolescence Notification and Resolution
Logistics
Automated Shipping Systems for FedEx and UPS