High Precision, Ultra Stable
Temperature Controllers & Laser Diode Drivers
High Precision, Ultra Stable
Temperature Controllers & Laser Diode Drivers
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Product Selector
Which controller is best for your application?
1) What maximum current does the application require?
2) Do you need laser diode control, temperature control or both? Combined controllers show in the integrated column.
3) What packaging does the application require? Components solder to a circuit board. Modules mount to a chassis heatsink or sit on the benchtop and connect to the load via cables.
MODEL
PACKAGE
MOUNTING
OPTIONS
CURRENT
COMBINES
LD & TC
SUMMARY
DETAILS
DATASHEET
 QCL2000 MODULE BENCHTOP or CHASSIS 2 A
 QCL1500 MODULE BENCHTOP or CHASSIS 1.5 A
 QCL1000 MODULE BENCHTOP or CHASSIS 1 A
 QCL500 MODULE BENCHTOP or CHASSIS 500 mA
 PLD12.5K-CH MODULE BENCHTOP or CHASSIS 12.5 A
 PLD10K-CH MODULE BENCHTOP or CHASSIS 10 A
 PLD5K-CH MODULE BENCHTOP or CHASSIS 5 A
 MPL7500 MODULE BENCHTOP or CHASSIS 7.5 A
 MPL2500 MODULE BENCHTOP or CHASSIS 2.5 A
 MPL500 MODULE BENCHTOP or CHASSIS 500 mA
 MPL250 MODULE BENCHTOP or CHASSIS 250 mA
 LDTC 2-2 O MODULE BENCHTOP or CHASSIS 2.2 A
 LDTC 2-2 E MODULE BENCHTOP or CHASSIS 2.2 A
 LDTC1020 MODULE BENCHTOP or CHASSIS 1 A
 LDTC0520 MODULE BENCHTOP or CHASSIS 500 mA
 USBKIT MODULE BENCHTOP or CHASSIS 12.5 A
 FL593FL EVAL BOARD BENCHTOP or CHASSIS 500 mA
 FL591FL EVAL BOARD BENCHTOP or CHASSIS 500 mA
 WLD3343-3L COMPONENT DIP PCB 3 A
 WLD3343-3A COMPONENT DIP PCB 3 A
 WLD3343HB COMPONENT DIP PCB 2.2 A
 WLD3343-2L COMPONENT DIP PCB 2.2 A
 WLD3343 COMPONENT DIP PCB 2.2 A
 PLD12500 COMPONENT DIP PCB 12.5 A
 PLD10000 COMPONENT DIP PCB 10 A
 PLD6500 COMPONENT SIP PCB 6.5 A
 PLD5000 COMPONENT SIP PCB 5 A
 PLD1250 COMPONENT SIP PCB 1.25 A
 PLD500 COMPONENT SIP PCB 500 mA
 PLD200 COMPONENT SIP PCB 200 mA
 LDD400 1, 2 OR 3P COMPONENT DIP PCB 400 mA
 LDD200 1, 2 OR 3P COMPONENT DIP PCB 200 mA
 FL500 COMPONENT SMT DIP PCB 500 mA
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