High Precision, Ultra Stable Temperature Controllers,
Quantum Cascade & Diode Laser Drivers
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Electronic Manufacturing Service Capabilities

Our advanced manufacturing facility and well-qualified engineers allow us to provide full-service product manufacturing with JIT-dependability, flexibility, and world-class quality.
  • Process Design for Optimal Cost, Yield, and Delivery:
    • Design for Manufacturability Evaluation and Process Plan is included in initial assessment
    • Technical Program Management
  • Printed Circuit Boards (PCBs):
    • Single- and Double-Sided Assembly
    • Surface-Mount (SMT), Through-Hole, and Mixed Technologies
    • Ball Grid Array (BGA) to 0.4mm pitch, and 0402 Packaged Components
    • RoHS-compliant or Leaded
    • Aqueous Wash or No-Clean Processes
    • Two SMT Lines
    • Selective Solder Machine for Plate-Through Automation
  • Electro-Mechanical Assembly:
    • Box Build
    • Cable Harness / Routing
    • Heatsink Assembly
    • Conformal Coat or Potting
  • Test & Troubleshoot: Test to your protocol to ensure 100% accurate build
  • Purchasing and Inventory Management:
    • Turnkey Component Sourcing — from your BOM and approved supplier list
    • Component Cost Reduction
    • End-of-Life and Obsolescence Notification and Resolution
  • Logistics — Automated Shipping Systems for FedEx and UPS
  • Quality Assurance Processes ensure builds are accurate and repeatable:
    • Workmanship Standards to IPC Class 2 or 3
    • Documentation Management of Bill of Materials and Assembly Instructions
    • Moisture Sensitive Parts Handling
    • Electro-Static Discharge (ESD) Prevention
    • Parts Sourcing ensures only approved parts are used
    • Visual Inspections throughout the build
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